Copper has a thermal conductivity of 401 W/(m·K) and a thermal conductivity of 115 mm²/s. Copper possesses high thermal conductivity and a large specific heat capacity, enabling it to quickly absorb and slowly release heat, making it an ideal material for heatsink bases and heat pipes. However, copper has disadvantages such as high density, heavy weight, high processing difficulty, and high cost.
Aluminum has a thermal conductivity of 238 W/(m·K) and a thermal conductivity of 100 mm²/s. Aluminum alloys have advantages such as lightweight, low cost, good plasticity, and ease of processing. Through processes such as aluminum extrusion, the pin-to-fin ratio can be increased to expand the effective heat dissipation area, but its thermal conductivity and heat storage performance are inferior to copper.
Copper-aluminum composite structures combine the advantages of copper's rapid heat absorption and aluminum's rapid heat dissipation, low cost, and ease of processing. A copper base and aluminum fins are typically used to achieve a balance between performance, weight, and cost. The key is to reduce the interfacial thermal resistance at the copper-aluminum interface.
Silver has the best thermal conductivity, but its high cost limits its application. Steel, due to its excellent corrosion resistance, is mostly used in specific applications such as radiator panels.
